Introducing Infineon’s OptiMOS™ power MOSFET in TOLx Packages
In today’s world, the need to achieve better power efficiency in a smaller footprint with longer lifetime is never more essential. Infineon fulfils the need for high current rating, ruggedness, and extended lifetime in applications with its OptiMOS™ TOLx MOSFET family.
Together, the well-established TO-Leadless package (TOLL), the TO-Leaded Top-side cooling (TOLT) and the TO-Leaded with Gullwing leads (TOLG) offer high-power, better thermal cycling on board robustness and superior thermal performance for high current designs.
TOLL: Optimized for high-power applications
Discover TO-Leadless: the package for high power density and high current application
High current applications such as power tools, light electric vehicles and fork lifts often result in MOSFETs being used in parallel, driving up board space and cost.
Infineon’s TOLL package increases power density with a 30% reduction in footprint compared to D²PAK, for much more compact designs. It is optimised to handle currents up to 300 A.
Features:
- Highest current capability up to 300 A
- Reduced electromigration due to improved solder contact
- Very low package parasitic
- Leadless package
Benefits:
- Less paralleling and cooling required
- Highest system reliability
- Low EMI
- Enabling very compact design
TOLG: High power density & superior thermal cycling
Discover the new TO-Leaded with gullwing for better thermal cycling on board (TCoB) performance
The TOLG package encompasses the best features from both TO-Leadless and D²PAK 7-pin. It has the same footprint and excellent electrical performance as TOLL. The advantage of TOLG is the flexibility enabled by the gullwing leads, which offer better joint reliability on the Aluminum-IMS board.
TOLG achieves two times improved Thermal Cycling on Board (TCoB) performance thanks to this feature compared to IPC-9701 standard requirements (IPC-9701).
Features:
- Low RDS(on) and high current rating >300 A
- Top-side cooling
- Negative stand-off
- Sn-free exposed pad
Benefits:
- High performance capability and system reliability
- High efficiency and lower EMI
- Optimized board utilization
- High thermal cycling on board performance
TOLT: Minimizing thermal resistance to heatsink
Discover the new TO-Leaded top-side cooling for superior thermal performance
The TOLT package offers the same high current low-profile benefits as the TOLL package with the additional advantage of top-side cooling for optimum thermal performance. With bottom-side cooling packages, like the TOLL or the D²PAK, the heat is dissipated via the PCB to the heatsink, resulting in high power losses.
With top-side cooling, the drain is exposed at the surface of the package allowing 95% of the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50% improved RthJC compared to the TOLL package.
Features:
- Gullwing leads
- High current rating >300 A
- Low ringing and voltage overshoot
- 60% space reduction compared to D²PAK 7-pin
Benefits:
- High performance capability and system reliability
- High efficiency and lower EMI
- Optimized board utilization
- High thermal cycling on board performance
Evaluation board EVAL_TOLT_DC48V_3KW
3 kW BLDC motor drive inverter power board based on TOLT with top-side cooling
The evaluation board features a motor drive inverter power stage using high efficiency, 100 V OptiMOS™ 5 power MOSFETs in top-side cooling TOLT package.
The top-side cooled MOSFET solution for 3-phase BLDC motor drive leads to increase power handling capability. The power board operates with Infineon’s XMC1300 Drive Card (KIT_XMC1300_DC_V1).
