Application Specific & Reference Design Kits
Parts from Application Specific & Reference Design Kits Category
DEV BOARD, PROTOTYPING PLATFORM; Silicon Manufacturer:Cypress; Silicon Core Number:CY8C4147Z1-S475; Kit Application Type:Embedded; Application Sub Type:Prototyping; Core Architecture:ARM; Core Sub-Architecture:Cortex-M0+; Silicon RoHS Compliant: Yes
MOD REF BOARD, RF TRANSCEIVER; Silicon Manufacturer:NXP; Silicon Core Number:MKW01; Kit Application Type:Wireless Development; Application Sub Type:RF Transceiver; Core Architecture:ARM; Core Sub-Architecture:Cortex-M0; Silicon RoHS Compliant: Yes
REF DESIGN BOARD, MKL25Z128VFM4 MCU; Silicon Manufacturer:NXP; Silicon Core Number:MK20DX128VFM5, MKL25Z128VFM4; Kit Application Type:Sensor Signal Conditioner; Application Sub Type:Data Logger; Core Architecture:ARM; Core RoHS Compliant: Yes
EVAL BOARD, RAPID DEVELOPMENT PLATFORM; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX32620/MAX77650/MAX17055; Kit Application Type:Embedded; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4 RoHS Compliant: Yes
REFERENCE DESIGN BOARD, BLDC MOTOR; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:C8051F850; Kit Application Type:Power Management - Motor Control; Application Sub Type:BLDC Motor; Core Architecture:8051; Core RoHS Compliant: Yes
DEMO/DEV KIT, BLUETOOTH LOW ENERGY; Silicon Manufacturer:Nordic Semiconductor; Silicon Core Number:NRF51822; Kit Application Type:RF / IF; Application Sub Type:Bluetooth Low Energy; Core Architecture:-; Core Sub-Architecture:-; RoHS Compliant: Yes
APPLICATION KIT, TRICORE TFT DISPLAY ROHS COMPLIANT: YES
GRAPHIC DISPLAY, 480X272, DEMO BOARD; Silicon Manufacturer:Microchip; Silicon Core Number:PIC24F; Kit Application Type:-; Application Sub Type:-; Core Architecture:PIC; Core Sub-Architecture:PIC24; Silicon Family Name:PIC24FJxxDAxxx;RoHS Compliant: Yes
EVALUATION BOARD, NETWORKING PROCESSOR; Silicon Manufacturer:NXP; Silicon Core Number:LS2085A; Kit Application Type:Communication; Application Sub Type:Networking; Core Architecture:ARM; Core Sub-Architecture:Cortex-A57 RoHS Compliant: Yes
REF DESIGN BOARD, COMM PROCESSOR; Silicon Manufacturer:NXP; Silicon Core Number:T1023; Kit Application Type:Communication & Networking; Application Sub Type:Embedded; Core Architecture:Power Architecture; Core Sub-Architecture:e5500 RoHS Compliant: Yes
REF DESIGN BOARD, USB TYPE-C PD CTRL ROHS COMPLIANT: YES
DEV BOARD, MOTOR CONTROL STEPPER MOTOR ROHS COMPLIANT: YES
EVALUATION BOARD, I2C MASTER/SLAVE; Silicon Manufacturer:NXP; Silicon Core Number:LPC1343; Kit Application Type:Interface; Application Sub Type:I2C Bus Interface; Core Architecture:ARM; Core Sub-Architecture:Cortex-M3 RoHS Compliant: Yes
High Bright (HB) LED Color Mix Board; Silicon Manufacturer:-; Silicon Core Number:-; Kit Application Type:-; Application Sub Type:-; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:-; Product Range:-